View MPXH6300AC6U_1282963.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

Freescale Semiconductor Technical Data
MPXH6300A Rev 4, 01/2007
High Temperature Accuracy Integrated Silicon Pressure Sensor for Measuring Absolute Pressure, On-Chip Signal Conditioned, Temperature Compensated and Calibrated
The Freescale MPXH6300A series sensor integrates on-chip, bipolar op amp circuitry and thin film resistor networks to provide a high output signal and temperature compensation. The small form factor and high reliability of on-chip integration make the Freescale pressure sensor a logical and economical choice for the system designer. The MPXH6300A series piezoresistive transducer is a state-of-the-art, monolithic, signal conditioned, silicon pressure sensor. This sensor combines advanced micromachining techniques, thin film metallization, and bipolar semiconductor processing to provide an accurate, high level analog output signal that is proportional to applied pressure. Figure 1 shows a block diagram of the internal circuitry integrated on a pressure sensor chip. Features * * * * * * Improved Accuracy at High Temperature Available in Small and Super Small Outline Packages 1.5% Maximum Error over 0 to 85C Ideally suited for Microprocessor or Microcontroller-Based Systems Temperature Compensated from -40 to +125C Durable Thermoplastic (PPS) Surface Mount Package
1 2 3 4 Device Marking MPXH6300A
MPXH6300A SERIES
INTEGRATED PRESSURE SENSOR 20 to 304 kPa (3.0 to 42 psi) 0.3 to 4.9 V OUTPUT
SUPER SMALL OUTLINE PACKAGES
MPXH6300A6U/6T1 CASE 1317-04
MPXH6300AC6U/C6T1 CASE 1317A-03
PIN NUMBERS(1)
N/C VS GND VOUT 5 6 7 8 N/C N/C N/C N/C
Application Examples * Industrial Controls * Engine Control/Manifold Absolute Pressure (MAP) ORDERING INFORMATION
Device Type Basic Element Options Absolute, Element Only Absolute, Element Only Ported Element Case No. 1317 1317 MPX Series Order No. MPXH63000A6U MPXH6300A6T1 Packing Options Rails
1. Pins 1, 5, 6, 7, and 8 are internal device connections. Do not connect to external circuitry or ground. Pin 1 is noted by the notch in the lead.
Tape & Reel MPXH6300A Rails MPXH6300A
Absolute, Axial 1317A MPXH6300AC6U Port Absolute, Axial 1317A MPXH300AC6T1 Port
Tape & Reel MPXH6300A
(c) Freescale Semiconductor, Inc., 2007. All rights reserved.
VS
Sensing Element
Thin Film Temperature Compensation and Gain Stage #1
Gain Stage #2 and Ground Reference Shift Circuitry
Vout
GND
Pins 1, 5, 6, 7, and 8 are NO CONNECTS for small outline package devices
Figure 1. Fully Integrated Pressure Sensor Schematic Table 1. Maximum Ratings(1)
Rating Maximum Pressure (P1 > P2) Storage Temperature Operating Temperature Output Source Current @ Full Scale Output(2) Output Sink Current @ Minimum Pressure Offset2 Symbol PMAX TSTG TA I o+ Io - Value 1200 -40 to +125 -40 to +125 0.5 -0.5 Unit kPa C C mAdc mAdc
1. Exposure beyond the specified limits may cause permanent damage or degradation to the device. 2. Maximum Output Current is controlled by effective impedance from Vout to GND or Vout to VS in the application circuit.
MPXH6300A 2 Sensors Freescale Semiconductor
Table 2. Operating Characteristics (VS = 5.1 Vdc, TA = 25C unless otherwise noted, P1 > P2.)
Characteristic Pressure Range Supply Voltage(1) Supply Current Minimum Pressure Offset @ VS = 5.1 Volts(2) Full Scale Output @ VS = 5.1 Volts(3) Full Scale Span @ VS = 5.1 Volts(4) Accuracy(5) Sensitivity Response Time(6) Warm-Up Time(7) Offset Stability(8) 1. Device is ratiometric within this specified excitation range. 2. Offset (Voff) is defined as the output voltage at the minimum rated pressure. 3. Full Scale Output (VFSO) is defined as the output voltage at the maximum or full rated pressure. 4. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum rated pressure. 5. Accuracy is the deviation in actual output from nominal output over the entire pressure range and temperature range as a percent of span at 25C due to all sources of error including the following: Linearity:Output deviation from a straight line relationship with pressure over the specified pressure range. Temperature Hysteresis:Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied. Pressure Hysteresis:Output deviation at any pressure within the specified range, when this pressure is cycled to and from the minimum or maximum rated pressure, at 25C. TcSpan:Output deviation over the temperature range of 0 to 85C, relative to 25C. TcOffset:Output deviation with minimum rated pressure applied, over the temperature range of 0 to 85C, relative to 25C. Variation from Nominal:The variation from nominal values, for Offset or Full Scale Span, as a percent of VFSS, at 25C. 6. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure. 7. Warm-up Time is defined as the time required for the product to meet the specified output voltage after the Pressure has been stabilized. 8. Offset Stability is the product's output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test. (0 to 85C) Symbol POP VS Io Voff VFSO VFSS -- V/P tR -- -- Min 20 4.74 -- 0.241 Typ -- 5.1 6.0 0.306 Max 304 5.46 10 0.371 Unit kPa Vdc mAdc Vdc
(0 to 85C)
4.847
4.912
4.977
Vdc
(0 to 85C)
4.476
4.606
4.736 1.5 -- -- -- --
Vdc
(0 to 85C)
-- -- -- -- --
-- 16.2 1.0 20 0.25
%VFSS mV/kPa ms ms %VFSS
MPXH6300A Sensors Freescale Semiconductor 3
Figure 2 illustrates the absolute sensing chip in the basic Super Small Outline chip carrier (Case 1317). Figure 3 illustrates a typical application circuit (output source current operation). Figure 4 shows the sensor output signal relative to pressure input. Typical minimum and maximum output curves are shown for operation over 0 to 85C temperature range. The output will saturate outside of the rated pressure range.
Fluoro Silicone Gel Die Coat P1 Wire Bond
A fluorosilicone gel isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the silicon diaphragm. The MPXH6300A series pressure sensor operating characteristics, internal reliability and qualification tests are based on use of dry air as the pressure media. Media other than dry air may have adverse effects on sensor performance and long-term reliability. Contact the factory for information regarding media compatibility in your application.
Die
Stainless Steel Cap
Thermoplastic Case
Lead Frame
Absolute Element Sealed Vacuum Reference
Die Bond
Figure 2. Cross Sectional Diagram SSOP (not to scale)
+5.1 V
VS Pin 2 100 nF MPXH6300A VOUT Pin 4 GND Pin 3 47 pF 51 K To ADC
Figure 3. Typical Application Circuit (Output Source Current Operation)
5.0 4.5 4.0 3.5 Output (Volts) 3.0 2.5 2.0 1.5 1.0 0.5 0 MIN MAX TYP
Transfer Function: Vout = Vs*(.00318*P-.00353) Error VS = 5.1 Vdc Temperature = 0 to 85C
Figure 4. Output versus Absolute Pressure MPXH6300A 4 Sensors Freescale Semiconductor
20 35 50 65 80 95 110 125 140 155 170 185 200 215 230 245 260 275 290 304 Pressure (Reference to Sealed Vacuum) in kPa
Transfer Function (MPXH6300A)
Nominal Transfer Value: Vout = VS x (0.00318 x P - 0.00353)
(Pressure Error x Temp Factor x 0.00318 x VS) VS = 5.1 0.36 Vdc
Temperature Error Band
MPXH6300A Series
4.0 3.0 Temperature Error Factor 2.0 1.0 0.0 -40 -20 0 20 40 60 80 100 120 140 Temperature in C NOTE: The Temperature Multiplier is a linear response from 0C to -40C and from 85C to 125C. Temp -40 0 to 85 125 Break Points Multiplier 3 1 3
Pressure Error Band
4.0 3.0 Pressure Error (kPa) 2.0 1.0 0.0 -1.0 -2.0 -3.0 -4.0 Pressure 20 to 304 (kPa) Error (Max) 4.0 (kPa) 20 60 100 140 180 220 260 300 Pressure (in kPa) Error Limits for Pressure
SURFACE MOUNTING INFORMATION
Minimum Recommended Footprint for Super Small Outline Packages Surface mount board layout is a critical portion of the total 0.050 0.387 design. The footprint for the semiconductor package must be 1.27 9.83 the correct size to ensure proper solder connection interface TYP between the board and the package. With the correct pad geometry, the packages will self-align when subjected to a 0.150 solder reflow process. It is always recommended to fabricate 3.81 boards with a solder mask layer to avoid bridging and/or shorting between solder pads, especially on tight tolerances and/or tight layouts.
0.027 TYP 8X 0.69 0.053 TYP 8X 1.35 inch mm
Figure 5. SSOP Footprint (Case 1317 and 1317A) MPXH6300A Sensors Freescale Semiconductor 5
PACKAGE DIMENSIONS
PAGE 1 OF 3
CASE 1317-04 ISSUE F SUPER SMALL OUTLINE PACKAGE
MPXH6300A 6 Sensors Freescale Semiconductor
PACKAGE DIMENSIONS
PAGE 2 OF 3
CASE 1317-04 ISSUE F SUPER SMALL OUTLINE PACKAGE
MPXH6300A Sensors Freescale Semiconductor 7
PACKAGE DIMENSIONS
PAGE 3 OF 3
CASE 1317-04 ISSUE F SUPER SMALL OUTLINE PACKAGE
MPXH6300A 8 Sensors Freescale Semiconductor
PACKAGE DIMENSIONS
PAGE 1 OF 2
CASE 1317A-03 ISSUE C SUPER SMALL OUTLINE PACKAGE
MPXH6300A Sensors Freescale Semiconductor 9
PACKAGE DIMENSIONS
PAGE 2 OF 2
CASE 1317A-03 ISSUE C SUPER SMALL OUTLINE PACKAGE
MPXH6300A 10 Sensors Freescale Semiconductor
How to Reach Us:
Home Page: www.freescale.com Web Support: http://www.freescale.com/support USA/Europe or Locations Not Listed: Freescale Semiconductor, Inc. Technical Information Center, EL516 2100 East Elliot Road Tempe, Arizona 85284 +1-800-521-6274 or +1-480-768-2130 www.freescale.com/support Europe, Middle East, and Africa: Freescale Halbleiter Deutschland GmbH Technical Information Center Schatzbogen 7 81829 Muenchen, Germany +44 1296 380 456 (English) +46 8 52200080 (English) +49 89 92103 559 (German) +33 1 69 35 48 48 (French) www.freescale.com/support Japan: Freescale Semiconductor Japan Ltd. Headquarters ARCO Tower 15F 1-8-1, Shimo-Meguro, Meguro-ku, Tokyo 153-0064 Japan 0120 191014 or +81 3 5437 9125 support.japan@freescale.com Asia/Pacific: Freescale Semiconductor Hong Kong Ltd. Technical Information Center 2 Dai King Street Tai Po Industrial Estate Tai Po, N.T., Hong Kong +800 2666 8080 support.asia@freescale.com For Literature Requests Only: Freescale Semiconductor Literature Distribution Center P.O. Box 5405 Denver, Colorado 80217 1-800-441-2447 or 303-675-2140 Fax: 303-675-2150 LDCForFreescaleSemiconductor@hibbertgroup.com
Information in this document is provided solely to enable system and software implementers to use Freescale Semiconductor products. There are no express or implied copyright licenses granted hereunder to design or fabricate any integrated circuits or integrated circuits based on the information in this document. Freescale Semiconductor reserves the right to make changes without further notice to any products herein. Freescale Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Freescale Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. "Typical" parameters that may be provided in Freescale Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals", must be validated for each customer application by customer's technical experts. Freescale Semiconductor does not convey any license under its patent rights nor the rights of others. Freescale Semiconductor products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Freescale Semiconductor product could create a situation where personal injury or death may occur. Should Buyer purchase or use Freescale Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold Freescale Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Freescale Semiconductor was negligent regarding the design or manufacture of the part. FreescaleTM and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. (c) Freescale Semiconductor, Inc. 2007. All rights reserved.
MPXH6300A Rev. 4 01/2007

▲Up To Search▲

Price & Availability of MPXH6300AC6U

	To Download MPXH6300AC6U Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .